JPH0224540Y2 - - Google Patents
Info
- Publication number
- JPH0224540Y2 JPH0224540Y2 JP18972087U JP18972087U JPH0224540Y2 JP H0224540 Y2 JPH0224540 Y2 JP H0224540Y2 JP 18972087 U JP18972087 U JP 18972087U JP 18972087 U JP18972087 U JP 18972087U JP H0224540 Y2 JPH0224540 Y2 JP H0224540Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pot
- coil
- terminal
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 86
- 238000005476 soldering Methods 0.000 claims description 27
- 239000002893 slag Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000004907 flux Effects 0.000 description 23
- 238000007689 inspection Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005112 continuous flow technique Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18972087U JPH0224540Y2 (en]) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18972087U JPH0224540Y2 (en]) | 1987-12-14 | 1987-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0196261U JPH0196261U (en]) | 1989-06-26 |
| JPH0224540Y2 true JPH0224540Y2 (en]) | 1990-07-05 |
Family
ID=31480735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18972087U Expired JPH0224540Y2 (en]) | 1987-12-14 | 1987-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224540Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7392926B2 (en) * | 2004-09-15 | 2008-07-01 | Hakko Corporation | Electrically-controlled soldering pot apparatus |
-
1987
- 1987-12-14 JP JP18972087U patent/JPH0224540Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0196261U (en]) | 1989-06-26 |
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